BGBM
Services and Features
MACMIC boasts a highly experienced professional team and stable backend processes, offering a wide range of gold bumping solutions as well as various front metal process solutions. With our comprehensive, one-stop services, we can assist you in efficiently achieving chip grinding and backside metallization growth in the shortest possible time.
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External Business
Backside Normal Grinding
Metal Evaporation for Backside Metallization -
Cooperative Business
Electro-less Plating
CP Testing
Wafer Sawing
Production Capacity
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GrindingEquipment Model:
DFG8540/DFG8560
Number of Units:
2
Compatible Wafer Diameter:
6-12 inches
Processing Capacity:
Fully automated, 25,000 wafers/month
Grinding Precision:
50 ± 5um
Final Thickness:
75-280um
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Backside MetallizationEquipment Model:
VAC601X、VAC1300S
Number of Units:
7
Compatible Wafer Diameter:
6-12 inches
Processing Capacity:
25,000 wafers/month
Standard Processes:
Titanium, Nickel, Silver, Tin, Aluminum, Thick Silver
